Ewe. I-304 insimbi engenasici ingathengiswa ngokufanelekileyo kwi-copper kwi-vacuum isebenzisa iintlobo ezahlukeneyo kunye ne-chemical soldering additives (BFM). Iintsimbi zokuzalisa ezisekelwe kwigolide, isilivere kunye ne-nickel zinokusebenza. Ekubeni ubhedu lukhula kancinci ngaphezu kwe-304 yensimbi engenasici, ingqalelo ekhethekileyo kufuneka ihlawulwe kwi-configuration yokudibanisa. Kule meko, amandla obhedu aya kuba aphantsi kakhulu, ngoko angakwazi ukufaka insimbi engenasici ngaphandle kokuguqulwa okubonakalayo.
Iindibano zeSolder zidla ngokuqhutywa kumaqondo obushushu ukuya kuthi ga kwi-4° Kelvin. Kukho uqwalaselo loyilo kunye nemida, kodwa igolide kunye nesilivere esekwe kwiintsimbi zokuzalisa ziqhele ukusetyenziswa kwesi sicelo.
3. Ndidinga ukuthengisa indibano enzima, kodwa andazi ukuba ndingathengisa njani yonke into ngaxeshanye. Ngaba i-multi-step soldering of components inokwenzeka?
Ewe! Umthengisi we-solder ochwephesha unokucwangcisa inkqubo ye-solder ye-multi-step. Cinga ngezinto ezisisiseko kunye ne-BFM ukwenzela ukuba i-solder ye-original joint ayinyibiliki kwi-run elandelayo. Ngokuqhelekileyo, umjikelo wokuqala uqhuba kwiqondo lokushisa eliphezulu kunemijikelezo elandelayo kwaye i-BFM ayiphindi ibuyele kwimijikelezo elandelayo. Ngamanye amaxesha i-BFM isebenza kakhulu ekusasazeni izithako kwi-substrate kangangokuba ukubuyela kubushushu obufanayo kunokubangela ukunyibilika kwakhona. I-soldering yamanyathelo amaninzi ingaba sisixhobo esifanelekileyo kunye nesisebenzayo sokuvelisa amacandelo ezonyango abiza kakhulu.
Le ngxaki ingasonjululwa! Kukho iindlela zokuthintela oku, eyona ndlela isebenzayo kukusebenzisa inani elifanelekileyo le-BFM. Ukuba umdibaniso uncinci kwaye uncinci kwindawo, kunokubonakala kumangalisa ukuba ingakanani i-BFM efunekayo ukuthengisa ngokufanelekileyo ukudibanisa. Bala indawo ye-cubic yendawo edibeneyo kwaye uzame ukusebenzisa i-BFM encinci kunendawo ebalwayo. Uyilo olufakelweyo olufakelwayo luyi-socket enesithukuthezi efana ne-ID ye-tubing, evumela i-BFM ukuba ihambe ngokuthe ngqo kwi-ID ye-tubing ngesenzo se-capillary. Shiya indawo ekupheleni kwetyhubhu ukukhusela isenzo se-capillary, okanye uyila i-joint ukuze i-tubing ikwazi ukuphuma kancinci ngaphaya kwendawo edibeneyo. Ezi ndlela zenza indlela enzima ngakumbi ukuba i-BFM ihambe ukuya ekupheleni kombhobho, ngaloo ndlela inciphisa umngcipheko wokuvala.
Lo mxholo uvela amaxesha ngamaxesha kwaye kufuneka uxoxwe. Ngokungafani neefayili ze-solder, ezenza amandla kwi-joint, iifayili ezinkulu ze-solder azichithi i-BFM kwaye zinokuba yingozi. Okubalulekileyo koko kungaphakathi. Ezinye ii-PM zi-brittle kwiifillet ezinkulu ngenxa yoxinaniso lwamacandelo angadibanisiyo asezantsi. Kule meko, nangona ukukhathala okuncinci, i-fillet inokuqhekeka kwaye ikhule ibe yintlekele. Xa i-soldering, encinci, ubukho obuqhubekayo be-BFM kwi-interface edibeneyo idla ngokuba yeyona ndlela ifanelekileyo yokuhlola okubonakalayo.